How can HIFU Warwickshire Help With Tighten the Dermis?
For the past decades, the surgical lift has been the number one solution for skin health. It’s no surprise because it can enhance patient’s appearance, reduce lines, eliminate wrinkles, save your time, increase the cohesiveness of the enhancement, and provide satisfying results. Despite that, the medical lift can cause infection, excess swelling, bleeding, fluid build-up, bruising, skin staining, irregularities, facial nerve injury, loss of hair in the cuts, and much more.
But there are safe and excellent alternatives you should try. High-Intensity Focused Ultrasound (HIFU) must be on top of your list. You probably have heard it before. But you might not have enough knowledge of how it works. Well, HIFU is a nonsurgical treatment that stimulates collagen within the dermis and SMAS. It can induce the contraction of both deep layers by focusing the ultrasound in a targeted area.
The epidermis comprises of the skin’s outermost layers. The dermis, on the other hand, is located beneath the former. It provides resistance and stretchable strength.
The SMAS, on the contrary, can be found in the subcutaneous fat. It envelops the muscles of human’s facial expression and extends to connect with the dermis. It composes of elastic fibres and collagen that are quite similar to the skin’s dermal layer.
HIFU targets these deep layers, making the skin tighter. After a single session, patients can see noticeable results. However, it depends on the specialist of your choice. Be sure to opt for an expert to maximise the results and avoid serious risks.
Tightening the dermis with HIFU technology provides instant rejuvenation. The method itself reaches the deeper layer, which in turn can deal with ageing and sagging.
As with other non-invasive procedures, HIFU can bypass the skin upper layer to focus on specific areas without potential risks.
As HIFU induces enough heat, the collagen and elastic fibre shorten. Then, the tissues tighten, reducing wrinkles, and other signs of ageing.